Rosti Wisconsin

Rosti Wisconsin – Bunsen Drive

The Bunsen Drive facility has operated on a fully-automated, “lights-out” basis since its opening in 2011. After nearly four years in operation and peaked production capabilities, 2015 marked a notable year with a 23,000 foot addition. The Bunsen Drive facility now houses 35 manufacturing cells.

The fundamental premise of the manufacturing strategy at Bunsen Drive is to run the facility “lights out,” with no direct labor used to produce components. State-of-the-art material handling systems, part conveyance systems, and robotics allow parts to be produced without the need for human involvement. This is the growth strategy for Rosti and this is how the company remains globally competitive.

Bunsen Drive is the future of manufacturing and is in fact, one of its kind. The United States Government issued Rosti a patent to validate the processes that take place within the facility. Every detail from the lighting to the part conveyance system, has been meticulously planned. This attention to the little nuances of a manufacturing plant is what separates this facility from others in the world. Infrastructure expansions will set the stage for the additional production presses.

The acquisition of a five-ton crane now allows the facility to be outfitted with larger machines. This will provide Rosti and our customers the ability to spread the highly efficient manufacturing process across a wide array of press sizes, depending on demand. Rosti looks forward to Bunsen Drive being a key area of growth.

Rosti Wisconsin – Morse Drive

Since the company’s inception, Rosti’s Morse Drive facility has expanded from an original size of 10,000 square feet to its current size of 40,000 square feet. The facility houses 46 fully-automated manufacturing cells (35 – 400 ton) and is home to our entire administrative, business development and engineering team. Morse Drive is also home to “Automation Lane”. This encompasses new technologies in automated insert molding as well as automated tray packing of highly engineered components.